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Demystifying Semiconductor Die Procurement
Webinar Recording

Bridging the Divide Between Semiconductor Die Manufacturers and the Processed Bare Die You Need!

Recorded June 20, 2023

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Why MIL-STD-1553 and What's New?
Webinar Recording

In this webinar, experts in MIL-STD-1553 interface and systems design share their many decades of knowledge, to provide system designers and engineers with an end-to-end overview of this fail-safe data bus protocol, along with what’s new and why it remains so ubiquitous in military platforms.

Recorded August 15, 2024

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Ruggedizing COTS Components for Hi-Rel Applications
Webinar Recording

Minimize cost and extend mission life by 3X or more, while utilizing the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology available.

Recorded September 28, 2023

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$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
Press Release

Micross has been awarded up to $134.3 million by the DoD under the IBAS Cornerstone RESHAPE program to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging solutions.

November 27, 2023

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Literature

Micross Overview Flyer

Micross
Overview

Space Solutions Gatefold

Space
Solutions

Aerospace & Defense Solutions Gatefold

Aerospace & Defense
Solutions

Missile & Defense Programs

Missile & Defense
Programs

Hi-Rel Power Solutions Flyer

Hi-Rel Power
Solutions

Hi-Rel RF Solutions Flyer

Hi-Rel RF
Solutions

Space-Grade Hi-Rel Diodes Flyer

Space-Grade
Hi-Rel Diodes

MIL-STD-1553 Technology Flyer

MIL-STD-1553
Technology

Nuclear Event Detector
(NED)

Space-Grade Ceramic MRAM Flyer

Space-Grade Ceramic
MRAM

Space-Grade QED MRAM Flyer

Space-Grade QED
MRAM

Data Bus Couplers & Harnesses Flyer

Data Bus Couplers & Harnesses

Die & Wafer Solutions Flyer

Die & Wafer
Solutions

EOL Die Sustainment
Program (EDSP)

Counterfeit Mitigation Services Flyer

Counterfeit Mitigation Services

DMSMS Sustainment Solutions Flyer

DMSMS Sustainment
Solutions

Advanced Interconnect Technology Flyer

Advance Interconnect Technology

Wafer-Level Packaging Flyer

Wafer-Level
Packaging

3D Integration Technology Flyer

3D Integration
Technology

Column Grid Array Flyer

Column Grid Array
(CGA)

BGA Reballing Flyer

BGA
Reballing

Robotic Hot Solder Dip (RHSD) Flyer

Robotic Hot Solder Dip (RHSD)

Component Modification Services Flyer

Component Modification Services

PEM Qualifications Flyer

PEM
Qualification

Test Solutions Flyer

Test
Solutions

Fine Gross Leak Testing Flyer

Fine Gross Leak
Testing

Rad-Hardened Logic Flyer

Rad-Hardened
Logic

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