- Component Modification
- +Component Solutions
- +PCB Solutions
- +Support Solutions
- +Additional Services
Micross is one of the few vendors with 3D scanning equipment. 3D scanning allows for minimum handling and maximizing in-line vision inspection for tray-to-tray, tray-to-tube, tray-to-tape, tube-to-tube, and tube to-tape.
Our 3D inspection capabilities include coplanarity, bent leads, sweep, pitch, standoff, ball height, ball diameter and true position of most package types including OIC, QFN, TSOP, TSSOP, SSOP, MSOP, SOJ, PLCC, QFP and BGA. Our state-of-the-art quality systems meet or exceed EIA-481.