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Global

Demystifying Semiconductor Die Procurement
Webinar Recording

Bridging the Divide Between Semiconductor Die Manufacturers and the Processed Bare Die You Need!

Recorded June 20, 2023

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Why MIL-STD-1553 and What's New?
Webinar Recording

In this webinar, experts in MIL-STD-1553 interface and systems design share their many decades of knowledge, to provide system designers and engineers with an end-to-end overview of this fail-safe data bus protocol, along with what’s new and why it remains so ubiquitous in military platforms.

Recorded August 15, 2024

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Ruggedizing COTS Components for Hi-Rel Applications
Webinar Recording

Minimize cost and extend mission life by 3X or more, while utilizing the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology available.

Recorded September 28, 2023

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$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
Press Release

Micross has been awarded up to $134.3 million by the DoD under the IBAS Cornerstone RESHAPE program to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging solutions.

November 27, 2023

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PCB Solutions

From board assembly, to rework, repair, and component harvesting, Micross Component Modification Services provides a full-turnkey solution sustaining your program by enabling  the use of existing  components and boards. 

Assembly

Assembling the most complex circuit cards, package-on-package components and difficult assembly jobs

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Rework

From fine pitch components to complex mixed-pitch patterns, we provide a level of precision rarely matched in the industry

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Repair

We'll perform trace modification in the most inaccessible areas, including under BGAs or other sensitive components

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Component Harvesting

We can salvage expensive and rare components, specializing in BGAs that need to be removed and/or reballed

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