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Demystifying Semiconductor Die Procurement
Webinar Recording

Bridging the Divide Between Semiconductor Die Manufacturers and the Processed Bare Die You Need!

Recorded June 20, 2023

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Why MIL-STD-1553 and What's New?
Webinar Recording

In this webinar, experts in MIL-STD-1553 interface and systems design share their many decades of knowledge, to provide system designers and engineers with an end-to-end overview of this fail-safe data bus protocol, along with what’s new and why it remains so ubiquitous in military platforms.

Recorded August 15, 2024

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Ruggedizing COTS Components for Hi-Rel Applications
Webinar Recording

Minimize cost and extend mission life by 3X or more, while utilizing the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology available.

Recorded September 28, 2023

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$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
Press Release

Micross has been awarded up to $134.3 million by the DoD under the IBAS Cornerstone RESHAPE program to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging solutions.

November 27, 2023

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Component Solutions

Utilize the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology  in your hi-rel application. Micross' Component Modification Services ruggedizes components to withstand the most extreme environments.

BGA Reballing

A process that flushes all lead-free balls and alloy residue from the pads and replaces them with Tin-Lead balls

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Robotic Hot Solder Dip (RHSD)

Eliminates the risk of tin whiskers without damaging the component

More info

Lead Attach

Proprietary process developed to maintain the integrity of component-to-PCB solder joints under stress

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CGA Attach

Guarantees a superior hi-reliability interconnect and best suited for assembly & component attached integrity

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Trim/Form & Reconditioning

Choose from various shipment options with the ability to customize to specifications

More info

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