- Die & Wafer Solutions
- +Distribution
- Alliance Memory
- Analog Devices
- Apogee Semiconductor
- Analog Power
- Avalanche Technology
- Central Semiconductor
- Diodes Incorporated
- Cypress
- Everspin Technologies
- Interfet
- International Rectifier
- ISOCOM Limited
- ISSI
- Knowles
- Linear Integrated Systems
- MACOM Technology
- Microchip
- Micron Technology
- NXP Semiconductors
- On Semi
- Renesas
- Samsung Semiconductors
- SemiQ Inc.
- Semicoa
- Texas Instruments
- Transys
- Vishay
- VPT Components
- +Quick Turn Services
- +Wafer Processing
- +EOL/DMSMS Sustainment
- +Component Design & Packaging
- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Multi-Chip Modules (MCMs)
- Wafer Bumping & WLP
- Design, Packaging & Assembly
- Assembly Services
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- +Distribution
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Largest authorized line card for bare die & wafer in the industry
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Broadest in-house capabilities to meet customer demands
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Most experienced engineering support team — design application & engineering solutions
As the largest global supplier of bare die with access to thousands of different part types, Micross offers unparalleled knowledge & extensive capabilities as well as the flexibility to adapt our suppliers’ standard products to the unique requirements of your device or system. Over the years, Micross has developed and maintained key relationships with many of the leading semiconductor manufacturers providing us with the capability to offer an extensive bare die portfolio to our customers.
From the simplest diodes to the most advanced analog ICs & high-end digital components, once the design requirements have been defined, we’ll work closely with you to create one complete solution.
Die and Wafer Solutions
Distribution
World's largest franchised offering of bare die & wafer with access to thousand of different part types
More infoQuick Turn Services
Micross Quick Turn now gets inventory to customers faster and easier than before. Quote, Order, Ship!
More infoWafer Processing
Comprehensive array of capabilities to fully process wafers; from wafer saw to wafer bumping for all materials
More infoAdditional Services
EOL/DMSMS Sustainment
Secure supply chains and extend lifecycles of EOL components decades past OEM production
More infoComponent Design & Packaging
Plastic & Hermetic ICs, MCMs, and advanced 2.5/3D integration packaging technologies
More info