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Demystifying Semiconductor Die Procurement
Webinar Recording

Bridging the Divide Between Semiconductor Die Manufacturers and the Processed Bare Die You Need!

Recorded June 20, 2023

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Why MIL-STD-1553 and What's New?
Webinar Recording

In this webinar, experts in MIL-STD-1553 interface and systems design share their many decades of knowledge, to provide system designers and engineers with an end-to-end overview of this fail-safe data bus protocol, along with what’s new and why it remains so ubiquitous in military platforms.

Recorded August 15, 2024

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Ruggedizing COTS Components for Hi-Rel Applications
Webinar Recording

Minimize cost and extend mission life by 3X or more, while utilizing the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology available.

Recorded September 28, 2023

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$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
Press Release

Micross has been awarded up to $134.3 million by the DoD under the IBAS Cornerstone RESHAPE program to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging solutions.

November 27, 2023

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BGA Reballing

Micross has a BGA Reballing Process that flushes all lead-free balls and alloy residue from the pads and replaces them with Tin-Lead balls. RHSD equipment remove the balls and refinish the pads resulting in 100% pad alloy replacement ensuring the strongest solder joint. Our reballing process has undergone extensive qualification testing at independent labs proving that the process is safe and reliable. Parts can be processed per IEC TS62647-4.

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Following are Some of Our Reballing Services:

  • Conversion to Tin-Lead
  • Conversion to RoHS Compliance
  • Ball Attach to LGA, QFN and DFN packages
  • Ball pitch from 0.40mm
  • Processing of ceramic and plastic BGAs and LGAs
  • LGA Gold Removal and Reballing
  • Conversion to leaded spheres for Hi-Rel Applications
Micross BGA Reballing Center of Excellence

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