DC-DC Power Supplies

Leader in power management solutions for hi-rel and
space applications with the most comprehensive array of
ruggedized hermetic hybrids and rad-hard PCB

Space

Complete range of hermetic & non-hermetic components
for space, with end-to-end services, including
packaging, ruggedization, screening and qualification

Aerospace & Defense

Complete range of components, semiconductors, and
end-to-end services, including packaging, testing,
qualification, ruggedization, and DMSMS sustainment

Energy

Complete range of hermetic components, semiconductors,
and end-to-end services, including packaging,
ruggedization, screening and qualification

Medical

Complete range of semiconductors, hermetic components,
and end-to-end services, including packaging,
ruggedization, screening and qualification

Press Release

Micross Acquires Integra Technologies

Expanding the Largest Hi-Rel Microelectronics OSAT Provider Located in the United States

Micross, a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, today closed the acquisition of Integra Technologies, one of the largest U.S. Outsourced Semiconductor Assembly and Test (OSAT) providers of semiconductor back-end services focused on high-reliability applications and end markets. The acquisition of Integra further positions Micross as a leader in United States-based OSAT services and further broadens Micross’ portfolio of high-reliability microelectronic services and products.

January 15, 2025

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Webinar

Applying COTS RF/Microwave in Space with Assurance

November 21, 2024

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Press Release

Micross Modernizes Near-Shored Hi-Rel Diodes Foundry & Operations

November 20, 2024

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Webinar

Why MIL-STD-1553 and What’s New?

August 15, 2024

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The Most Complete Provider of…
Hi-Rel Microelectronics & Services

Die & Wafer

The World’s Largest Franchised Offering of Die, Wafer & Value Added Services

  • Die & Wafer Distribution
  • Thinning, Saw, Sort, Inspect
  • Wafer Bumping
  • Long Term Die/Wafer Storage
  • EOL Die Sustainment (EDSP)
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Hi-Rel Power

Leader in Power Management Solutions for Hi-Rel and Space Applications

  • Aerospace & Defense Hybrid DC-DC Converters
  • Space-Grade Hybrid & PCB DC-DC Converters
  • EMI Filters
  • Discrete Diodes
  • ISOPAC® Assemblies
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Hi-Rel Components

QML Certified Supplier for MIL-PRF-38535, MIL-PRF-38534, & MIL-PRF-19500

  • Memory, Analog, Logic & RF/mW
  • CSP/Plastic & Hermetic Package
  • ASIC Design, Wafer Level Packaging, MCMs
  • Advanced Packaging, 2.5/3D Heterogeneous Integration
  • MIL-STD-1553 and Data Bus Couplers & Harnesses
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Testing & Qualification

DMEA Trusted Source & an Extensive Array of Testing Services

  • Counterfeit Mitigation
  • PEMS Qualification & Up-screening
  • Component Test/Inspection & Qualification
  • RF & Digital, Electrical & Environmental Test
  • Burn-In, ACBI & Mechanical Reliability Test
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Component Modification

Leader in Component Modification with Best-in-Class Proprietary Processes

  • BGA Reballing & Robotic Hot Solder Dip
  • Trim, Form, Reconditioning
  • Lead Attach
  • CGA Interconnects
  • Marking, Labeling, & Kitting
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EOL/DMSMS Sustainment

Complete Program Sustainment from Initial Production through Post-EOL

  • Original Qualified Products
  • Product Recreation
  • Form-Fit-Function Equivalent
  • Program Sustainment Management
  • Supplier Managed Inventory
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Local Support… Worldwide
Operations, Engineering, & Field Support

Field Support

Locations

One Source
One Solution

News & Info

Trade Shows View all

Aero India 2025

February 10-14

Bengaluru, India

Booth #G5.5c

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Satellite 2025

March 11-13

Washington, DC

Booth #1644

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GOMACTech

March 17-20

Pasadena, CA

Booth #522

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AUSA Global Force

March 25-27

Huntsville, AL

Booth #2429

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