Event
Hi-Rel Power Solutions Celebrates Grand Opening in Denmark
New Center-of-Excellence for the Design and Manufacture of High-Reliability PCB Based Power Solutions
The AS9100 and ISO9001 facility is the 4th Micross microelectronics manufacturing facility in Europe, and our 17th globally within the Micross ecosystem of end-to-end high-reliability microelectronics products and services. This new facility in Ballerup is a major upgrade from our former site, housing a 9,000 sq/ft design center and test lab, including a dedicated setup for EMC testing; and our new 7,500 sq/ft manufacturing operations, outfitted with the latest and most advanced production equipment, providing engineering designers in the space, defense, medical, energy and other high-reliability markets, with world-class manufacturing capabilities to create optimized high-reliability PCB based power solutions, that most-efficiently and reliably serve their specific requirements.
March 11, 2025
More infoPress Release
Micross Modernizes Near-Shored Hi-Rel Diodes Foundry & Operations
November 20, 2024
More infoThe Most Complete Provider of…
Hi-Rel Microelectronics & Services



Die & Wafer
The World’s Largest Franchised Offering of Die, Wafer & Value Added Services
- Die & Wafer Distribution
- Thinning, Saw, Sort, Inspect
- Wafer Bumping
- Long Term Die/Wafer Storage
- EOL Die Sustainment (EDSP)

Hi-Rel Power
Leader in Power Management Solutions for Hi-Rel and Space Applications
- Aerospace & Defense Hybrid DC-DC Converters
- Space-Grade Hybrid & PCB DC-DC Converters
- EMI Filters
- Discrete Diodes
- ISOPAC® Assemblies

Hi-Rel Components
QML Certified Supplier for MIL-PRF-38535, MIL-PRF-38534, & MIL-PRF-19500
- Memory, Analog, Logic & RF/mW
- CSP/Plastic & Hermetic Package
- ASIC Design, Wafer Level Packaging, MCMs
- Advanced Packaging, 2.5/3D Heterogeneous Integration
- MIL-STD-1553 and Data Bus Couplers & Harnesses

Testing & Qualification
DMEA Trusted Source & an Extensive Array of Testing Services
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- RF & Digital, Electrical & Environmental Test
- Burn-In, ACBI & Mechanical Reliability Test

Component Modification
Leader in Component Modification with Best-in-Class Proprietary Processes
- BGA Reballing & Robotic Hot Solder Dip
- Trim, Form, Reconditioning
- Lead Attach
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- Marking, Labeling, & Kitting

EOL/DMSMS Sustainment
Complete Program Sustainment from Initial Production through Post-EOL
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