March 2025: Expanding Manufacturing Capabilities

The Most Complete Provider of Advanced Microelectronic Services 
and Component, Die & Wafer Solutions

March 2025 | Expanding Manufacturing Capabilities

This month, we celebrated the grand opening of our European Center-of-Excellence for the Design and Manufacture of Hi-Rel PCB-Based Power Solutions. This marks a key milestone in our ongoing commitment to providing efficient standard and custom space-grade DC-DC solutions. We congratulate Rex Anderson, Director of Operations at Micross AIT, for being awarded 3D InCites' “Engineer of the Year”!  Join us May 1^st for our upcoming webinar, “Chiplets: Optimized Device Integration, SWaP Performance & Time-to-Market," this will be a great opportunity to hear from industry experts and discuss the latest innovations in microelectronics technology. We’ll also be exhibiting and speaking at several conferences in the coming months and look forward to connecting with you in person to support your high-reliability requirements!

New Facility Grand Opening

Micross Celebrates the Grand Opening of its Hi-Rel Power Design Center & Manufacturing Facility in Ballerup, Denmark

March 11^th, 2025 - We’re excited to announce the grand opening of our Hi-Rel Power Solutions facility in Ballerup, Denmark! A ribbon cutting was held Tuesday, March 11th commemorating the launch of our new center-of-excellence for the design and manufacture of high-reliability PCB based power solutions.
The AS9100 and ISO9001 facility is the 4th Micross microelectronics manufacturing facility in Europe, and our 17th globally within the Micross ecosystem of end-to-end high-reliability microelectronics products and services. This new facility in Ballerup is a major upgrade from our former site, housing a 9,000 sq/ft design center and test lab, including a dedicated setup for EMC testing; and our new 7,500 sq/ft manufacturing operations.

Awards

3D InCites' "Engineer of the Year"

March 4^th, 2025 - Rex Anderson, Director of Operations at Micross AIT was awarded with the "Engineer of the Year" Award for going above and beyond to engage with his peers through participation in industry organizations, whether it’s teaching professional development courses or mentoring young engineers. 

Rex heads the Secure Center for Advanced Packaging of Excellence (SCAPEx), Micross’ most significant initiative under the DoD RESHAPE program to on-shore 300mm wafer bumping and finishing.

Upcoming Webinar

Chiplets - Optimized Device Integration, SWaP Performance & Time-to-Market

Date/Time: May 2nd, at 11am ET
Duration: 1 Hour 

Chiplets are the next generation of SiP – integrating multiple devices/functions in a single package, enabling SWaP optimization and higher performance systems. In this webinar, experts in BEOL processing, advanced 2.5/3D heterogenous integration, testing, and component packaging will discuss the latest developments, standards, protocols, and chiplet design methodology. Save the date for our upcoming webinar to keep informed on the leading microelectronic technologies of today and tomorrow!

Tradeshows & Events

Micross will be showcasing our latest solutions for space, aerospace, defense, RF, and other hi-rel markets. Our product experts and executives will be on site to discuss your technical and program needs.

Upcoming

2025 Counterfeit Electronics and Materials Symposium

April 15-16

London, England

CALCE (Center for Advanced Life Cycle Engineering) and SMTA are excited to bring this long-running symposium to the United Kingdom for the second year in collaboration with the Anti-Counterfeiting Forum.

Featured Speaker:

Sultan Lilani, Director of Business Development at Integra Technologies

28th Annual Components for Military & Space Electronics Conference & Exhibition

April 29 - May 1

Los Angeles, CA

Integra Booth #T9

Focused on the design, reliability, and application of electronic components for use in both terrestrial applications for avionics, aerospace, and military, as well as commercial, civilian, and military space systems.

ECTC

May 27-30

Dallas, TX

Booth #331

The premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

Past

Satellite 2025

March 11-13, 2025 – A great week was had exhibiting at the Satellite 2025 conference in Washington, DC, and the number of attendees and exhibitors eclipsed 2024 by a wide margin. It was clearly evident that the expansion of the satellite market is accelerating, and we enjoyed making many new connections, supporting our current customers and partners in attendance, and sharing our new offering of cost-efficient space-grade microelectronics solutions for "New Space". Thank you to all who visited the Micross booth, we look forward to working with you!

GOMACTech

March 17-20, 2025 –  John Lannon (General Manager of Micross AIT) took the stage at the Onshoring Advanced Packaging Capabilities Workshop, sparking insightful conversations both on the show floor and at our booth. We are looking forward to continuing these discussions forward as we strive to enhance the microelectronics industry with robust and secure supply chain supporting mission-critical systems. 

AUSA Global Force

March 25-27, 2025 – We are honored to have participated in AUSA Global Force, where we proudly showcased our comprehensive end-to-end semiconductor solutions. These innovations play a crucial role in empowering our national defense partners, driving the development of cutting-edge technologies, and ensuring the sustainment of vital defense capabilities.

IDEA Summit 2025

March 28, 2025 – Anthony Mestre, General Manager of Micross Premier Semiconductor Services, discussed the escalating threat of counterfeit electronic components and its impact on critical sectors like defense and healthcare at the recent IDEA Summit. Key points included the stronger government enforcement, increased public-private collaboration, and the adoption of advanced detection technologies to safeguard supply chains.