Title: Chiplets - Optimized Device Integration, SWaP Performance & Time-to-Market
Date/Time: May 1st, 2025 at 11am ET
Chiplets are the next generation of SiP – integrating multiple devices/functions in a single package, enabling SWaP optimization and higher performance systems. In this webinar, experts in BEOL processing, advanced 2.5/3D heterogenous integration, testing, and component packaging will discuss the latest developments, standards, protocols, and chiplet design methodology. Save the date for our upcoming webinar to keep informed on the leading microelectronic technologies of today and tomorrow!