- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
When a military-grade device is made obsolete, designers must scramble to find a replacement to avoid the unwelcome prospect of redesigning the product for a different device. In many cases, there is a readily available commercial off-the-shelf (COTS) version of the same part in the same package that could fill the need—but only if the parts can be shown to meet military-grade temperature requirements. To address this challenge, Micross PCM offers up-screening services. Working to customer's specifications, we design a custom workflow using well-maintained, calibrated equipment in our laboratory.
- Core competencies in mechanical, electrical and environmental testing needed for upscreening
- Wide range of quality certifications including AS9100, ISO9001, and MIL-STD-750
Advantages
- Broad Array of Components & Packages
- Lower Cost of BOM
- SWaP Optimized
- Rapid Procurement
- Withstand Mechanical Shock & Vibration
Technologies Include:
- SoC, ASICs, RF and Memory
- Analog and Mixed Signal Devices
- Digital and Logic Devices
- Discrete Semiconductor and Passives Plus Many Others
Ancillary Services to COTS/PEMs Screening and Qualification:
- Component Modification: RHSD, BGA Reballing
- Alternative Paths for Failing COTS/PEMs
- Bare Die and Wafer Procurement
- Plastic and Hermetic Assembly
- Destructive Physical Analysis (DPA) and Failure Analysis (FA)
Flyer - PEM Qualifications
Webinar - Preparing Microelectronics for Hi-Rel Applications