When Military or Space grade products are not available, Micross will recondition COTS product to OEM specifications.
Component Solutions
Re-tin ROHS compliant parts where leaded interconnects are required
- Robotic Hot Solder Dip
- BGA Reballing
Lead Attach
- Lead Attach to ceramic or plastic Leadless Chip Carrier
- Lead Replacement
- CGA Attach
Reform leads to OEM specification
- Trim & Form
- Reconditioning of bent or damaged leads
Packaging
- Lead Attach to ceramic or plastic Leadless Chip Carrier
- Tape and Reel
- 3D Scan
- Bake and Package
- Marking & Labeling
PCB Solutions
- Rework & Repair enabling Non-working qualified PCBs to be reused
- Specializing in package-on-package, LGA, QFN, CSP and other challenging components
- Adhere to IPC-7711/7721 rework standards
- 4-point inspection on each component placed
- 5D X-ray, used to locate & address the most difficult manufacturing and reworking issues
- Trace modification in inaccessible areas, under BGAs or other sensitive components
- Repair damaged traces and solder mask, incorrectly installed components, defects
- Restore pad sites for any component, including fine-pitch and variable-pitch BGAs, QFNs, and package-on-package stacks
- Removal and replacement of BGA, Micro BGA, and flip-chip, plus the majority of fine-pitch components