- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Hi-Rel RF & Microwave Microelectronics
Along with being the most complete provider of advanced microelectronic services and component, die and wafer solutions, Micross is a leading manufacturer of RF and Microwave surface mount semiconductor components and hybrids, for space, aerospace, and defense applications. With the broadest authorized access to die & wafer suppliers, and the most comprehensive advanced packaging, assembly, modification and test capabilities, Micross is uniquely positioned to provide unparalleled high-reliability solutions from bare die, to fully packaged devices, to complete program life-cycle sustainment.
Streamline Development & Reduce Risk with Micross Hi-Rel RF Solutions
Micross Hi-Rel RF Solutions brings technology together to solve the most demanding RF and Microwave semiconductor requirements of the Space, Aerospace, and Defense Industry. Proven capabilities include semiconductor circuit and package design, microelectronic assembly, RF testing, and environmental screening to meet the most demanding and cost-sensitive hardware requirements for products through 50 GHz. Product offering extends well into the 40 GHz range.
Device Manufacturing
- Microelectronics Assembly
- Eutectic bonding
- Epoxy die bonding
- Wedge and ball bonding
- Wire bonding
- Visual/bond pull inspection
- Pre-seal vacuum bake
- Hermetic solder seal
- Hermetic seam seal
- Non-hermetic epoxy seal
- Ink or engrave marking
- Package lead forming
Device Testing/Screening
- Small Signal RF (DC to 40 GHz)
- Large Signal RF (DC to 40 GHz)
- Data Recording
- Fixture De-embedding
- DC Parameters
- Custom ATE Development
- MIL-STD 750
- MIL-STD 883
- MIL-STD 19500
- MIL-PRF 38534
- MIL-PRF 38535
Device Evaluation/Qualification
- Product Realization
- Element Evaluation
- Wafer Lot Acceptance
- Life Testing
- Destructive Physical Analysis
- Residual Gas Analysis
- Radiation Testing
Program & Component Management
- Counterfeit and Obsolescence
- Customer Design Reviews
- Project Management
At the Forefront of New Frontiers
Our Hi-Rel RF products are a part of these space projects:
- GPS III
- MSP BLOCK III
- KH-5 ARGON
- WGS
Flyer - Micross Hi-Rel RF SolutionsCustom & Multi-Chip Modules
Building block integration, optimize SWaP performance & reliability, part management reduction
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