- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Micross provides Apogee technology as bare die, standard components, “Retail +” mil-temp screened integrated circuits (ICs), “QED” MIL-PRF-38535 qualified plastic encapsulated microcircuits (NASA/Goddard Space EEE-INST-002, Level 2 PEMs), or as MIL-PRF-38534 qualified hermetic ICs, and all of these formats can be optimized for specific application needs through value-added enhancements.
Logic Devices Include
- Function
- Translators
- Transceivers
QED (Qualified Encapsulated Device):
Plastic encapsulated microcircuit screened and qualified to NASA electrical, electronic and electromechanical instructions EEE-INST-002, section M2 as a Level 2 PEM.
Hermetic:
Addresses the hi-reliability requirements for deep space missions and ultimate reliability.
Flyer - Micross Rad-Hardened LogicLoading …