- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Micross' BOM monitoring services utilize the most advanced technology & resources to help ensure uninterrupted product supply.
What's Included...
- Active monitoring of the required components and die for your program, with regular status reporting of component and die health
- - Includes monitoring of both components and their required die Contingency Planning
- - Proactive replacement solution for all parts
- Real-time data analytics from the most advanced platforms for component risk mitigation and compliance management
- Notifications for EOL/PCN die and components as soon as they are released by the manufacturer, and in some cases, advanced notification can be provided prior to EOL/PCN release.
- Micross will contact you to discuss initiating one of our product replacement
Part Research & BOM Analysis
Lifecycle
Availability
Compliance
Alternate Parts/Component/Die
Counterfeit Parts Identification
EOL/PCN
Alerts & Management
Electronics Supply Chain Analysis
Alternative or replacement part identification
Counterfeit Risk Management
Supplier Risk Management