- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Need Component Validation Services?
Micross’ Premier Counterfeit Mitigation test lab performs screening of components in accordance with defined government & industry standards. As an independent third-party lab, Micross is a clear choice to help complete your BOM with known good parts when failure is not an option and every second counts!
Rest Assured with Micross
DLA Certified
Micross’ Premier Counterfeit Mitigation Services, is a quality-driven, independent, ITAR-Registered counterfeit mitigation lab that performs screening of customer-supplied components, and is certified to ISO/IEC 17025:2017, AS6171, and AS6081. For 20+ years our testing services have enabled an elevated level of assurance for contractors providing electronic components to the DoD. Micross is a wholly owned Independent Test House (from source of supply) with facilities in North America and Europe.
Industry Leading Turn Around Time
▶ AS6081: As Fast As 3 Days!
▶ AS6171 (Full-Lot Testing): As Fast As 2 Weeks!
▶ Individual Lab Tests: As Fast As 3 Days!
Complete Portfolio of Counterfeit Mitigation Testing Services
Documentation
- Package
- Labels
Physical
- Orientation
- Leads or Spheres
- Marking
- Size, Weight, and Shape
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Internals (Non-Destructive)
- X-Ray
- Die, Shape, and Size
- Lead Frame
- Bond Wires
Composition
- Correct Metals
- Lead/Lead-Free
Marking
- Resistance to Solvents
- 3:1 Spirits/Alcohol
- Acetone
- Heated Solvents
- Dynasolve
- Scraping
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Internal Destructive
- Decapsulation
- Die Markings
Solderability
- Leads Free of Contaminants and/or Corrosion
Electrical Performance
- Confirm Operation
Qualified to the Highest Standards
Micross inspects the component and packaging using the IDEA 1010 methodology and checklist to identify non-conformances on the IC body, leads and markings. High powered inspection equipment and experienced highly trained lab technicians, combined with Micross’ Counterfeit Database are all factors ensuring that any external issues are identified and documented.
Certifications
- AS9100D/ISO9001:2015
- ITAR Registered
- ANSI/ESD S20.20:2021
- CCAP-101
- ISO/IEC 17025:2017 - AS6171
- DLA Certified AS6081: A1, A3, A4, A5, A6
- FSC 5962 Limited Electrical Test per QTSL-5961 / 5962 3.1.3
- MIL-STD-750 - Test Methods (3001, 3011, 3036, 3041, 3061, 3066, 3071, 3076, 3406, 3407, 3411, 3413, 4001, 4011, 4016, 4021, 4022, 4023)
- Flows:
- Customer specific, Source Control Drawing (SCD) Raytheon, L3Harris, NGC, etc.
- ITAR Process
- JEDEC Standards
Flyer - Micross Premier Counterfeit Mitigation
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