Space Tech Expo Europe 2024
November 19-21
Bremen, Germany
Booth C40
For more information, please visit the Space Tech Expo Europe webpage
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- Component Design & Packaging
- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Multi-Chip Modules (MCMs)
- Wafer Bumping & WLP
- Design, Packaging & Assembly
- Assembly Services
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- MIL-STD-1553
- Memory
- Logic Devices
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- Nuclear Event Detector (NED)
- Hi-Rel Power Solutions
- Hi-Rel RF Solutions
- Component Design & Packaging
- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- Hi-Rel Data Bus Couplers & Harnesses
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
- Hi-Rel Diodes
Why MIL-STD-1553 and What's New?
Webinar Recording
In this webinar, experts in MIL-STD-1553 interface and systems design share their many decades of knowledge, to provide system designers and engineers with an end-to-end overview of this fail-safe data bus protocol, along with what’s new and why it remains so ubiquitous in military platforms.
Recorded August 15, 2024
- Products & Services
- Components - Portsmouth, UK
- Hi-Rel Power Solutions - Ballerup, DK
- Component Modification
- CMS - Crewe, UK
$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
Press Release
Micross has been awarded up to $134.3 million by the DoD under the IBAS Cornerstone RESHAPE program to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging solutions.
November 27, 2023
Space Tech Expo Europe 2024