September 2024: Supply Chain Solutions

The Most Complete Provider of Advanced Microelectronic Services 
and Component, Die & Wafer Solutions

September 2024 | Supply Chain Solutions

Are the hi-rel devices you need unavailable? Micross is the one source solution to keep production running and ensure uninterrupted supply chains! In this newsletter we're excited to announce the launch of our hybrid DC-DC converter cross reference tool. Additionally, this issue highlights our up-screening and End-of-Life Die Sustainment Program. Meet with our product experts & executives to discuss your hi-rel requirements in person, see our listing of upcoming conferences where Micross will be exhibiting!

Hi-Rel DC-DC Power Conversion

Cross Reference Tool

Having trouble sourcing power converters? Our new cross reference tool makes it easy to find substitute parts! 

With an extensive line of MIL-PRF-38534 Class H & K hybrids, with power outputs ranging from 5W to 120W, along with the ability to design custom DC-DC converters, Micross is uniquely able to support your hi-rel power conversion needs.

MIL-Grade & Space-Grade Upscreening

Complete COTS/PEMs 
Up-Screening & Qualification 

When a military or space grade device is made obsolete, designers must scramble to find a replacement to avoid the unwelcome prospect of redesigning the product for a different device. Working to customer's specifications, we design a custom workflow using well-maintained, calibrated equipment in our laboratory. The upscreening process identifies COTS that meets customer-specific requirements to serve as replacements for the obsolete or unavailable devices.

Counterfeit Mitigation

Keeping Production Running

As an independent third-party lab, Micross is a clear choice to help complete your BOM with known good parts when failure is not an option and every second counts! Micross’ counterfeit mitigation lab performs screening of components in accordance with defined government & industry standards.

✔ AS6081 Testing as fast as 3 days

✔ AS6171 testing as fast as 2 weeks

✔ Individual lab tests as fast a 3 days

EOL/DMSMS Sustainment

End-of-Life Die Sustainment Program (EDSP)

EDSP provides continuous device availability for products that have or may become end-of-life, enabling the avoidance of costly re-qualification, overhead costs, resource utilization, and production delays. 

OEMs & CMs (Consumers) Fortify your supply chain & ensure a continuous supply of components throughout the entire life-cycle of your program. Micross will  provide long-term storage for bare die and materials, and will process, package, and test devices as needed.

ODMs (Suppliers) Micross enables you to maintain your legacy portfolio and refocus product line resources by utilizing our world-class value-added die handling and packaging services to manufacturer your devices.

Tradeshows

Micross will be showcasing our latest solutions for space, aerospace, defense, RF, and other hi-rel markets. Our product experts and executives will be on site to discuss your technical and program needs.

IMAPS Symposium

Booth #117

October 1-2

Boston, MA

PAINE Conference - Physical Assurance & Inspection of Electronics

November 12-14

Huntsville, AL

Space Tech Expo Europe

Booth #C40

November 19-21

Bremen, Germany