October 2024: COTS RF/mW Microelectronics for Space

The Most Complete Provider of Advanced Microelectronic Services 
and Component, Die & Wafer Solutions

October 2024 | COTS RF/mW Microelectronics for Space

Supply chain pressures driven by the increased demand for satellites have forced system designers to face the hard decision between deploying costly custom hi-rel RF/mW devices, or more readily available and cost effective COTS components with a higher risk of failure. Addressing this issue, we invite you to join our upcoming live webinar on "Applying RF/mW COTS in Space with Assurance". Also, we're pleased to congratulate John Lannon (GM, Micross AIT) for receiving the IMAPS Society's Technical Achievement Award! Meet with our product experts & executives in person to discuss your hi-rel requirements; see our listing below of upcoming conferences where Micross will be exhibiting. 

Webinars

Minimize Space Systems
Development Time and Costs...
Apply COTS RF/mW with Assurance

Date/Time: November 21st, at 11am ET
Duration: 1 Hour 

If an optimized custom hi-rel RF/mW device is desired, but the costs and lengthy development schedule are not practical, you'll benefit from attending this webinar.  We’ll provide you with insights and best practices to better understand options to optimize your solution between standard, modified COTS and custom solutions RF/mW devices, for space applications. 

Space-Grade RF/mW Microelectronics

Streamline Development and Reduce Risk

Accelerate time-to-market leveraging the most extensive, pre-qualified portfolio of RF & Microwave SMT components and hybrids, for space, aerospace & defense applications. With over 20 years of space heritage and zero flight failures, Micross is a global leader in the manufacture of SWaP optimized, synthesized multi-layer single and multi-function RF/µW devices through 40+ GHz, from DC to Ka band. 

Awards

William D. Ashman - John A. Wagnon Technical Achievement Award 

(October, 2024) John Lannon, General Manager of Micross AIT was awarded with the "William D. Ashman - John A. Wagnon Technical Achievement Award" for his outstanding technical contributions to the microelectronics packaging industry, while participating and demonstrating support of activities to enhance the profession as a member of IMAPS.

Advanced Packaging

Micross AIT 

For more than 30 years, Micross Advanced Interconnect Technologies (AIT) has enabled next-generation high-performance SWaP optimized devices, offering a complete array of advanced packaging solutions including: wafer bumping, WLP, 2.5 & 3D heterogenous integration, and MEMS microfabrication.

Micross AIT is DMEA Trusted IC Supplier

Tradeshows

Micross will be showcasing our latest solutions for space, aerospace, defense, RF, and other hi-rel markets. Our product experts and executives will be on site to discuss your technical and program needs.

PAINE Conference - Physical Assurance & Inspection of Electronics

November 12-14

Huntsville, AL

Space Tech Expo Europe

Booth #C40

November 19-21

Bremen, Germany