February 2025: The Chiplet Advantage... Optimized Microelectronics

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and Component, Die & Wafer Solutions

February 2025 | The Chiplet Advantage... Optimized Microelectronics

Designers looking to increase performance and functionality are turning to chiplets, but why? Chiplet methodology enables the integration of multiple devices/functions in a single package, utilizing standardized protocols providing ease of integration, and enabling SWaP optimization. Keep up-to-date on the latest chiplet developments, and save the date for our upcoming webinar on “Chiplets - Optimized Device Integration, SWaP Performance & Time-to-Market”. Also included in this issue, a complete guide on preparing bare die & wafer for packaging, to realize maximum yield and cost savings! Meet with our product experts & executives to discuss your hi-rel requirements in person, visit the conferences where we will be exhibiting at in March.

Upcoming Webinar

Chiplets - Optimized Device Integration, SWaP Performance & Time-to-Market

Date/Time: May 1st, at 11am ET
Duration: 1 Hour 

Chiplets are the next generation of SiP – integrating multiple devices/functions in a single package, enabling SWaP optimization and higher performance systems. In this webinar, experts in BEOL processing, advanced 2.5/3D heterogenous integration, testing, and component packaging will discuss the latest developments, standards, protocols, and chiplet design methodology. Save the date for our upcoming webinar to keep informed on the leading microelectronic technologies of today and tomorrow!

Die & Wafer Solutions

Die Inspection 

Die inspection for semiconductors is a critical process that ensures the quality and reliability of semiconductor devices. This inspection involves examining the individual die, or chips, on a semiconductor wafer for defects, such as cracks, contamination, or improper dimensions. By identifying these issues early, manufacturers can prevent faulty products from reaching the market, ultimately enhancing performance and customer satisfaction.

For more information, read Integra's February FAQ Newsletter! Integra is a Micross Company. 

Tradeshows

Micross will be showcasing our latest solutions for space, aerospace, defense, RF, and other hi-rel markets. Our product experts and executives will be on site to discuss your technical and program needs.

Upcoming

Satellite 2025

March 11-13

Washington, DC

Booth #1644

GOMACTech - Government Microcircuit Applications & Critical Technology Conference

March 17-20

Pasadena, CA

Micross Booth #522

Integra Booth #422

AUSA Global Force

March 25-27

Huntsville, AL

Booth #2429

Past

Aero India

February 10-14, 2025 – An exciting week was had at Aero India, thank you to everyone who visited our booth and thank you to our incredible product experts & executives who answered all your questions.  

L3 Engineering Week

February 19, 2025 – Micross had the honor of attending an event hosted by L3Harris Technologies , marking a significant occasion during EWeek, an annual celebration of National Engineers Week.