August 2024: Life-Cycle Management with Die & Wafer Sustainment

The Most Complete Provider of Advanced Microelectronic Services 
and Component, Die & Wafer Solutions

August 2024 | Life-Cycle Management with Die & Wafer Sustainment 

In this newsletter we address the challenges of extending the availability of microelectronics beyond their natural product life-cycle with the Micross End-of-Life Die Sustainment Program (EDSP). OEM/CM consumers and ODM suppliers of components can ensure a continuous supply devices through our long-term die & wafer storage, along with our extensive processing, packaging, test and qualification capabilities. Additionally, we’re excited to share the recording of our recent webinar “Why MIL-STD-1553 and What’s New?”, and invite you to meet with us at our upcoming tradeshow exhibits!

Complete Life-Cycle Sustainment

EOL Die Sustainment Program 

EDSP provides continuous device availability for products that have or may become end-of-life, enabling the avoidance of costly re-qualification, overhead costs, resource utilization, and production delays.

OEMs & CMs (Consumers) Fortify your supply chain & ensure a continuous supply of components throughout the entire life-cycle of your program. Micross will  provide long-term storage for bare die and materials, and will process, package, and test devices as needed.

ODMs (Suppliers) Micross enables you to maintain your legacy portfolio and refocus product line resources by utilizing our world-class value-added die handling and packaging services to manufacturer your devices.

The Micross Advantage

• Decades of Proven Success, Unparalled Expertise and Capabilities
• Secure Atmosphere & Temperature Controlled Storage Environments
• Best-in-Class Capabilities in Die/Wafer Processing, and Component Packaging, Assembly, Test, and Qualification
• Micross is Uniquely Positioned to Procure a LTB of Available Die/Wafers through our EDSP Program
• Eliminate the Need for Costly Redesign & Re-Qualification by Utilizing Original Qualified Die
• Micross Maintains an Authorized Chain of Custody

On-Demand Webinar

Why MIL-STD-1553 & What's New? 
The 5-Decade Standard for Flight Control & Weapons Systems Sees No End in Sight

Recorded: August 15th, 2024
Duration: 1 Hour

In this webinar, experts in MIL-STD-1553 interface and systems design share their many decades of knowledge and experience to provide system designers and engineers with an end-to-end overview of this fail-safe data bus protocol, and the best practices for its use in embedded military and aerospace applications.  Attendees and viewers will gain deep insight to leverage the value and performance of 1553 for their high-reliability data bus communications. 

Tradeshows

Micross will be showcasing our latest solutions for space, aerospace, defense, RF, and other hi-rel markets. Our product experts and executives will be on site to discuss your technical and program needs.

Bengaluru Space Expo

Booth #77A

September 18-20

Bangalore, India

EUMW - European Microwave Week

RFMW Booth #502J

September 24-26

Paris, France

IMAPS Symposium

Booth #117

October 1-2

Boston, MA