Burn-In

With the ITC360™, testing can be conducted directly on the bench without the use of interconnect devices. Real-time monitoring provides early detection of overheating to avoid deterioration and defective components, modules or systems. STS employs intelligent burn-in within a liquid environment called Thermal Electric Cooling, is a critical undertaking that requires accurate understanding of the process, the device under test (DUT) and the actual application of the device.

For burn-in-with-test requirements, STS has invested in the High-Power Burn-In System (HPB-5B) from Micro Control Company (MCC). This sophisticated tool performs burn-in-with-test on high-powered VLSI, microprocessors, and memory devices. The HPB-5B also performs engineering characterization, life test and peak load production screening. STS has the ability to test in liquid, including salt-water simulated environments.

For RF device testing, STS has created the Advanced Chamberless Burn-in to test HTOL of RF devices in a bench-top, open-air environment to offer greater efficiency at lower costs. This state-of-the-art proprietary tool allows for temperature regulation of individual devices.