- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Micross’ Program Sustainment Management ensures uninterrupted product supply through providing BOM monitoring, long term die & wafer storage, and supplier managed inventory.
BOM Monitoring & Reporting
Active monitoring, contingency planning, proactive replacement, real time data analytics, notifications for EOL/PCN die and components
More infoLong Term Die & Wafer Storage
Providing semiconductor die/wafer procurement & storage as well as large-capacity bare die banks, which can hold stock from a single diffusion run
More infoSupplier Managed Inventory
Procurement, holding and management, BOM monitoring, modification/testing, holding of finished goods, delivery to customer defined location
More info