- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Utilizing original qualified parts eliminates the need for costly requalification or design changes. With exclusive access to the broadest supply of global die, along with our EOL Die Sustainment Program (EDSP), component harvesting, product reconditioning and counterfeit mitigation services, Micross can source original qualified parts that have or will become end-of-life.
EOL Die Sustainment Program (EDSP)
Avoiding costly re-qualification and re-designs, mitigate counterfeit risk, and sustain the performance of critical platform
More infoProduct Reconditioning
Military or Space grade products are unavailable, we will recondition COTS products to OEM specifications with our solutions
More infoComponent Harvesting
Over 20 years of experience in safely harvesting components for board repair and re-use with a fully automated process
More info