- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
ESD Characterization
- Micross has the capability to test at 2304 pins per device and capacity
- Added capacity expansion in the CDM, MM and HBM tests
- Vector generator for latch-up
- Expertise in specialty EOS testing
- Meets all industry specifications (JEDEC, ESDA, AEC, IEC, MIL STD)
- Offers multi-device support
- We carry universal test boards for ESD to cater to our customers’ needs
ESD Equipment Portfolio
- KeyTek ZAPMASTER MK.4
- Oryx EX11000S
- Haefely PESD 3010
- Hanwa HED-C5000R
Micross STS provides advanced ESD Characterization services within the Silicon Valley.
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Flyer - Micross Test Solutions
Webinar - Preparing Microelectronics for Hi-Rel Applications