- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Reliability Tests
- Characterize devices for a wide array of electrical (DC/RF), mechanical and environmental stresses to ascertain best-in-class FIT rates
Level I & Level II Qualification
- Evaluate die, package and board-level reliability
Qualification Regime
- Smart Burn-in, HAST, ESD, EFR, IME, ACBI™
Customized Reliability Tests
- Customized product qualification plans
- Specialized set-ups, real-time in-situ monitoring and data-logging capabilities
Failure Analysis
- Capability to perform in-depth investigation of failures
Customized Screening Capability
- Capability to screen parts as per customer requirements for Flight and ITAR applications
Micross STS provides advanced test services and serves as one of the laboratories of choice within Silicon Valley.