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Demystifying Semiconductor Die Procurement
Webinar Recording

Bridging the Divide Between Semiconductor Die Manufacturers and the Processed Bare Die You Need!

Recorded June 20, 2023

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Why MIL-STD-1553 and What's New?
Webinar Recording

In this webinar, experts in MIL-STD-1553 interface and systems design share their many decades of knowledge, to provide system designers and engineers with an end-to-end overview of this fail-safe data bus protocol, along with what’s new and why it remains so ubiquitous in military platforms.

Recorded August 15, 2024

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Ruggedizing COTS Components for Hi-Rel Applications
Webinar Recording

Minimize cost and extend mission life by 3X or more, while utilizing the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology available.

Recorded September 28, 2023

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$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
Press Release

Micross has been awarded up to $134.3 million by the DoD under the IBAS Cornerstone RESHAPE program to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging solutions.

November 27, 2023

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Device Characterization

Micross provides a comprehensive array of complete Turnkey Test & Device Characterization solutions inclusive of the following capabilities:

 

Test Program Development
  • Multiple platform expertise
Characterization
  • High-speed yield optimization
Wafer Sort/Wafer Probe
  • Up to 300mm wafer probe
Production Test
  • Full IC package testing and hybrid testing. Wafer-level testing. High-speed, multi-site delivery
Program Conversion
  • Technology migration to improve cost effectiveness

Micross’ in-house technically-advanced engineering team can support all technologies, including RF, digital, linear, analog mixed signal and memory.

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