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Demystifying Semiconductor Die Procurement
Webinar Recording

Bridging the Divide Between Semiconductor Die Manufacturers and the Processed Bare Die You Need!

Recorded June 20, 2023

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Why MIL-STD-1553 and What's New?
Webinar Recording

In this webinar, experts in MIL-STD-1553 interface and systems design share their many decades of knowledge, to provide system designers and engineers with an end-to-end overview of this fail-safe data bus protocol, along with what’s new and why it remains so ubiquitous in military platforms.

Recorded August 15, 2024

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Ruggedizing COTS Components for Hi-Rel Applications
Webinar Recording

Minimize cost and extend mission life by 3X or more, while utilizing the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology available.

Recorded September 28, 2023

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$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
Press Release

Micross has been awarded up to $134.3 million by the DoD under the IBAS Cornerstone RESHAPE program to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging solutions.

November 27, 2023

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Fine & Gross Leak Test

Also referred to as Seal or Hermeticity Test, this test verifies that the hermetic seal of a component is intact and typically follows trim and form and/or RHSD of a glass seal device.

GEIA-STD-0006 Finish Replacement Qualification

The industry specification for conversion of Pb-free to tin-lead termination finishes is easily satisfied by our process. Most customers decline the test requirements based upon confidence of our robotic process, but testing is readily available at Micross.

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The GEIA-STD-0006 Compliant Process includes:
  • Robotic-controlled six-axis dipping
  • Solder dipping under a nitrogen blanket
  • Solder-level sensing for accurate solder dipping
  • Integral component wash and dry facility
  • Preheating of components to negate thermal shock
  • Lead tinning/solder dip
  • Terminal finish conversion

IEC TS 62647-4 Qualification Ball Grid Array (BGA) Reballing

The industry specification for conversion of Pb-free BGAs to tin-lead solder balls finishes is satisfied by our process. Most customers decline the test requirements based upon confidence of our robotic process, but testing is readily available at Micross.

Ionic Contamination
Detects ionic contamination on the part that can cause current leakage between leads.

Solderability

Verifies termination finishes will readily accept solder during assembly using J-STD-002 or any military test method.

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