- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Flip Chip and Multi-Chip Module Assembly
Micross AIT offers a wide array of flip chip assembly capabilities, from single chip placements to multi-chip module and system-in-package assembly of multiple die and components.
- Flip chip assembly for single and multi-chip applications
- Precision die placement with accuracies better than +/- 0.5 microns
- Heterogeneous integration with Si, III-V and other device types/materials
- Plasma Assisted Dry Soldering (PADS) Process enables true fluxless for assembly for Sn-bearing solders
Metal-Metal Bonding for 2.5/3D Technologies
2.5D and 3D integration technologies are driving the integration of devices with extremely high interconnect densities for Si interposer and chip stacking applications.
- Solid/liquid interdiffusion assembly with CuSn-Cu bump arrays demonstrated down to 10 micron pitch
- Cu/Cu thermocompression bump bonding demonstrated down to 5 micron pitch
- Solutions for chip stacking and high thermal stability interconnects that remain solid at high temperatures
Flyer - Micross Advanced Interconnect Technology
Webinar - Optimizing Hi-Rel Electronics Design for Your Applications