- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Providing full assembly services as well as the one source for all of your packaging needs.
Unlike many of our competitors, Micross has a comprehensive array of in-house assembly capabilities that spans both the United States and Europe. Our automated and state-of-the-art die attach, wire bond, encapsulation and CSP capabilities allow us to provide competitive solutions for a broad range of technologies. In addition, Micross manufacturing sites are registered to the AS9100 Standard reinforcing our commitment to always providing the highest quality of products and services while continuing to meet the stringent needs of our aerospace, space, defense and medical customers.
Webinar - Optimizing Hi-Rel Electronics Design for Your Applications