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Demystifying Semiconductor Die Procurement
Webinar Recording

Bridging the Divide Between Semiconductor Die Manufacturers and the Processed Bare Die You Need!

Recorded June 20, 2023

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Why MIL-STD-1553 and What's New?
Webinar Recording

In this webinar, experts in MIL-STD-1553 interface and systems design share their many decades of knowledge, to provide system designers and engineers with an end-to-end overview of this fail-safe data bus protocol, along with what’s new and why it remains so ubiquitous in military platforms.

Recorded August 15, 2024

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Ruggedizing COTS Components for Hi-Rel Applications
Webinar Recording

Minimize cost and extend mission life by 3X or more, while utilizing the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology available.

Recorded September 28, 2023

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$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
Press Release

Micross has been awarded up to $134.3 million by the DoD under the IBAS Cornerstone RESHAPE program to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging solutions.

November 27, 2023

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ZAC

Part Number: ZAC

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Description

Documentation

ZAC

Details
  • ProductFamily: ZAC
  • NumberOfOutput: 1
  • OutputPower: 325W
  • OutputConfiguration: Output 1: 0.5A to 10A at 3V to 32.5V
  • KeyApplicationsAndFeature: Laser Diode Driver for optical communication
    Adjustable constant current
    Adjustable maximum output voltage
    Over voltage protection
    Tray with wedge-locks
  • Size_mm_LWH: 100 x 254 x 24.6 (board)
    100 x 254 x 26 (incl. Tray)
  • Mass: < 640g (board)
    < 830g (incl. tray)

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