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Demystifying Semiconductor Die Procurement
Webinar Recording

Bridging the Divide Between Semiconductor Die Manufacturers and the Processed Bare Die You Need!

Recorded June 20, 2023

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Why MIL-STD-1553 and What's New?
Webinar Recording

In this webinar, experts in MIL-STD-1553 interface and systems design share their many decades of knowledge, to provide system designers and engineers with an end-to-end overview of this fail-safe data bus protocol, along with what’s new and why it remains so ubiquitous in military platforms.

Recorded August 15, 2024

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Ruggedizing COTS Components for Hi-Rel Applications
Webinar Recording

Minimize cost and extend mission life by 3X or more, while utilizing the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology available.

Recorded September 28, 2023

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$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
Press Release

Micross has been awarded up to $134.3 million by the DoD under the IBAS Cornerstone RESHAPE program to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging solutions.

November 27, 2023

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Component Modification

With over 40 years of in-depth expertise, Micross CMS provides an unparalleled array of hi-rel microelectronic product, packaging, test & qualification capabilities servicing the space, defense, aerospace, medical, communications, & other hi-rel markets. From pioneering RHSD in 1984, Micross remains the leader as the one source solution for component services. Turnkey & SMI available, S20.20 Certified.

BGA Reballing

Component Solutions

Utilize the latest COTS components, chip designs, and technology in your hi-rel application.

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PCB Solutions

Full turnkey solutions sustaining your program by enabling the use of existing components and boards.

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Support Solutions

Full turnkey solutions for modifying, testing, and preparing components for our customers.

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