- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
MIL-PRF-38534 covers screening requirements that all parts are submitted to as well as Quality Conformance Inspection consisting of one or more of Group A, B, C and D for acceptance of the design of the process and of the production lot.
MIL-PRF-38534 applies to multi-chip modules and systems such as power modules or DC-DC converters.
For more information on MIL-PRF-38534 screening and quality conformance inspection, consult the DoD document or contact Micross.
MIL-PRF-38534 Screening Requirements
| Test/Inspection | Screening Level | MIL-STD-883-Method | |
|---|---|---|---|
| Class H | Class K (Space Level) | ||
| Pre-Seal Burn-In | Optional | Optional | 1030 |
| Nondestructive Bond Pull | N/A | 100% | 2023 |
| Internal Visual | 100% | 100% | 2017 |
| Temperature Cycle | 100% | 100% | 1010 |
| Constant Acceleration | 100% | 100% | 2001 |
| Mechanical Shock | 100% | 100% | 2002 |
| Particle Impact Noise Detection (PIND) | N/A | 100% | 2020 |
| Preburn-In-Electrical | Optional | 100% | |
| Burn-In | 100% | 100% | 1015 |
| Final Electrical | 100% | 100% | |
| Seal | 100% | 100% | 1014 |
| Radiographic | N/A | 100% | 2012 |
| External Visual | 100% | 100% | 2009 |
EM Screening Flow for DC-DC Converters
| Part Number Designator | /EM | /CK | |
|---|---|---|---|
| Compliance Level | MIL-PRF-38354 | N/A | K Level Compliant |
| Screening Requirement | MIL-STD-883 TM | ||
| Temperature Range | - | Ambient | -55°C to +85°C |
| Element Evaluation | MIL-PRF-38534 | N/A | Class K |
| Non-Destructive Bond Pull | 2023 | N/A | Yes |
| Internal Visual | 2017 | Micross Defined | Yes |
| Temperature Cycle | 1010 | N/A | Cond. C |
| Constant Acceleration | 2001, Y1 Axis | N/A | 3000 Gs |
| PIND | 2020 | N/A | Cond. A |
| Burn-In | 1015 | N/A | 320 hrs @ 125°C (2 x 160 hrs) |
| Final-Electrical (Group A) | MIL-PRF-38534 & Specification | Ambient | -55°C, +25°C, +85°C |
| PDA | MIL-PRF-38534 | N/A | 2% |
| Seal, Find and Gross | 1014 | N/A | Cond. CH |
| Radiographic | 2012 | N/A | Yes |
| External Visual | 2009 | Micross Defined | Yes |
MIL-PRF-38534 Quality Conformance Inspection
MIL-PRF-38534 Group A Electrical Testing
| Sub Group | Parameters | Quantity (Accept Number) |
|---|---|---|
| 1 | Static Tests at +25°C | 116 (0) |
| 2 | Static Tests at Max. Rated Operating Temp. | 76 (0) |
| 3 | Static Tests at Min. Rated Operating Temp. | 45 (0) |
| 4 | Dynamic Tests at 25°C | 116 (0) |
| 5 | Dynamic Tests at Max. Rated Operating Temp. | 15 (0) |
| 6 | Dynamic Tests at Min. Rated Operating Temp. | 45 (0) |
| 7 | Functional Tests at +25°C | 116 (0) |
| 8 | Functional Tests at Max. & Min. Rated Operating Temp. | 76 (0) |
| 9 | Switching Tests at +25°C | 116 (0) |
| 10 | Switching Tests at Max. Rated Operating Temp. | 76 (0) |
| 11 | Switching Tests at Min. Rated Operating Temp. | 45 (0) |
MIL-PRF-38534 Group B Testing
| Sub Group | Parameters | Quantity (Accept Number) | Class | |
|---|---|---|---|---|
| K | H | |||
| 1 | Physical Dimension | 2 (0) | X | X |
| 2 | PIND | 15 (0) | X | |
| 3 | Resistance to Solvents | 3 (0) | X | X |
| 4 | Internal Visual and Mechanical | 1 (0) | X | X |
| 5 | Bond Strength: a. Thermocompression b. Ultrasonic or Wedge c. Flip-Chip d. Beam Lead |
2 (0) | X | X |
| 6 | Die-Shear Strength | 2 (0) | X | X |
| 7 | Solderability | 1 (0) | X | X |
| 8 | Seal: a. Fine b. Gross |
15 (0) | X | |
| 9 | ESD: a. Electrical Parameters b. ESDS c. Electrical Parameter |
3 (0) | X | X |
MIL-PRF-38534 Group C Testing
| Sub Group | Parameters | Quantity (Accept Number) | Class | |
|---|---|---|---|---|
| K | H | |||
| 1 | Physical Dimension | 2 (0) | X | X |
| 2 | PIND | 15 (0) | X | |
| 3 | Resistance to Solvents | 3 (0) | X | X |
| 4 | Internal Visual and Mechanical | 1 (0) | X | X |
| 5 | Bond Strength: a. Thermocompression b. Ultrasonic or Wedge c. Flip-Chip d. Beam Lead |
2 (0) | X | X |
| 6 | Die-Shear Strength | 2 (0) | X | X |
| 7 | Solderability | 1 (0) | X | X |
| 8 | Seal: a. Fine b. Gross |
15 (0) | X | |
| 9 | ESD: a. Electrical Parameters b. ESDS c. Electrical Parameter |
3 (0) | X | X |
MIL-PRF-38534 Group D Package Related Testing
| Sub Group | Parameters | Quantity (Accept Number) |
|---|---|---|
| 1 | Thermal Shock | 5 (0) |
| Stabilization Bake | 5 (0) | |
| Lead Integrity | 1 (0) | |
| Seal: a. Fine b. Gross |
5 (0) | |
| 2 | Moisture Resistance | 5 (0) |
| 3 | Salt Atmosphere | 5 (0) |
| 4 | Metal Package Isolation | 3 (0) |